| Maximum sample size (L x W x H) |
220 x 70 mm; 8"-Wafer on WT 200 M/E, 12"-Wafer on WT 300 M/E with OCA 20L |
| Size of sample stage |
100 x 100 mm |
| Range of contact angle measurement |
0...180o ; +- 0.1o measuring accuracy of the video system |
| Range of surface and interfacial tension |
1 10-2 ... 2 103 mN/m; resolution: min. +- 0.05 mN/m |
| Optics |
Six-fold zoom lens (0.7...4.5-fold magnification) with integrated fine focus (+- 6 mm)
and high light transmitting capacity
CCD-camera with a resolution of max. 768 x 576 pixels
Field of view (FOV): 1.75 x 1.4...11.7 x 9 mm
Optical distortion: < 0.05 %
|
| Video system |
High-performance image processing system with 132 MBytes/s data transfer rate (compatible to European standard CCIR and US standard RS-170)
Up to 360images/s.
|
| Measuring methods |
Sessile and Captive Drop method
Tilting Plate method
Pendant Drop method
Optical Wilhelmy Plate and Lamella method |
| Temperature measurement and range |
2x Pt100 input for -10...400 oC (Pt100 optional), 0.1 K resolution; 1/3 DIN IEC 751 (+-0.03 %), class B |
| Size of device (L x W x H) |
590 x 220 x 550 mm |
| Weight |
18 kg |
| Power supply |
100...240 VAC; 50...60 Hz; 55 VA |