The thermal evaporation technique is widely used for the growth of metal layers for electronic applications: we use different coating materials to obtain both schottky and ohmic contacts.
This evaporation system is equipped for the deposition of three different materials in sequence without breaking the vacuum.
- Coating Material: Al, Ag, Au, Ni, Ti, Si, Cu
- Evaporation Sources: Mo, Ta, W, BN, Al2O3
- Pumping System: turbomolecular and mechanical pump in sequence (ultimate vacuum 10-8 Torr )
- Power Supplies: AC transformer ( Imax = 600 A)