Field assisted glass-silicon sealing, also referred to as anodic bonding, is a process which permits the sealing of silicon to glass well below the softening point of the glass.
- The two surfaces to be bonded together must have a surface roughness of less than 100 nm to allow the surfaces to mate closely.
- The pieces to be bonded are assembled and heated on a hot plate to a temperature ranging between 400-500 °C.
- A DC power supply is connected to the assembly such that the silicon is positive with respect the glass.
- When a voltage on the order of a few hundred volts is applied across the assembly the glass seals to the metal.
Schematic diagram of the experimental setup for anodic bonding of pyrex glass to silicon