Materials and Processes for Micro & Nano Technologies

Processing Instruments

Anodic Bonding

Field assisted glass-silicon sealing, also referred to as anodic bonding, is a process which permits the sealing of silicon to glass well below the softening point of the glass.

• The two surfaces to be bonded together must have a surface roughness of less than 100 nm to allow the surfaces to mate closely.
• The pieces to be bonded are assembled and heated on a hot plate to a temperature ranging between 400-500 °C.
• A DC power supply is connected to the assembly such that the silicon is positive with respect the glass.
• When a voltage on the order of a few hundred volts is applied across the assembly the glass seals to the metal.

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Schematic diagram of the experimental setup for anodic bonding of pyrex glass to silicon

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