Materials and Processes for Micro & Nano Technologies

Processing Instruments

Laser Processing

The processing laser system is able to perform micro ablation on several kinds of materials such as silicon, metals, polymers. The main features are:

• Wavelength 1064 nm
• Power 20 W CW
• Active medium Nd:YVO₄, end-pumped (laser diode 50 W @ 808 nm)
• Pulse width : > 7ns
• Frequency 0 - 200 kHz
• Peak power: > 500 kW
• Beam quality M² < 1.5
• Linear polarization
• Spot laser diameter down to 3.8 mm
• High precision focus positioning
• Processing area: 130 x 130 mm with automatized xy stage (resolution 100 nm)