Materials and Processes for Micro & Nano Technologies

Processing Instruments

Plasma Etching Facilities

---

Plasmafab 508

---

Plasmafab 508 chamber characteristic

Available gas lines

• SF₆, CF₄, O₂

Pumping system

• mechanical pump

Plasma generation

• radio frequency (13.56 MHz) capacitive discharge
• maximum power 500 W

---

BIO-RAD Plasma Asher E 2000

---

BIO-RAD Plasma Asher E2000

Available gas lines

• SF₆, CF₄, O₂

Pumping system

• mechanical pump

Plasma generation

• radio frequency (13.56 MHz) capacitive discharge
• maximum power 500 W