Chilab

Materials and Processes for Micro & Nano Technologies

  • Research activities
    • About Us
    • People
    • News
    • Technologies for "Bio"
      • Energy & Environment
        • Technologies for Industry 4.0 & Smart Manufacturing
          • Theory & Modeling
          • Experimental facilities
            • Systems for Thin-film Growth and Surface Treatments
              • Cleanrooms
                • Rapid Prototyping & Additive Manufacturing
                  • Lithographic Tools
                    • Etching Facilities
                      • Polymeric Machining
                        • Chemical & Bio-chemical Labs
                        • Characterizations
                          • Nanomechanical sensing
                          • Competences
                            • MEMS & Microsensors
                            • Laser Micromachining
                            • Microfluidics
                            • Rapid Prototyping & Additive Manufacturing
                            • Plasma assisted surface modification at the nanoscale
                            • Electronic Systems
                            • Photonics
                            • Atomistic Simulations
                            • Chemical & Biochemical Functionalizations
                            • Nanomaterials Synthesis
                            • FVM & FEM Simulations
                            • Bioprinting
                          • Projects
                          • Publications & Patents
                          • Spinoff & Partners
                          • Open Positions & Master Theses

                          Experimental facilities

                          • Systems for Thin-film Growth and Surface Treatments
                            • LPCVD
                            • Furnace System
                            • Thermal & E-Gun Evaporation
                            • Sputtering
                            • PZT sol-gel
                            • Rapid Thermal Annealing (RTA)
                            • Electroplating
                            • Low Pressure Plasma Polymerization System
                            • ECR/RF PECVD deposition system
                            • RF Magnetron sputtering (monotarget)
                            • Atmospheric Pressure Plasma System
                            • Single-layer Graphene growth
                            • Atomic Layer Deposition (ALD)
                            • ICPCVD
                            • Parylene Deposition
                          • Cleanrooms
                            • Chilab Cleanroom
                            • Trustech Cleanroom
                          • Rapid Prototyping & Additive Manufacturing
                            • 3D InkJet Printing
                            • Computer Numerical Control (CNC) Milling
                            • Micro Electro-Discharge Machining
                            • FDM 3D Printer
                            • Micro Stereo Lithography
                            • 3D Plastic Sintering
                            • Micro Stereo Lithography (custom)
                            • Ink-Jet Printing
                            • Two-Photon Polymerization (2PP)
                          • Lithographic Tools
                            • Front & Back-side UV Lithography
                            • Laser Pattern Generator
                          • Etching Facilities
                            • Plasma Etcher
                            • Reactive Ion Etching (RIE)
                            • Deep Reactive Ion Etching (DRIE)
                            • Wet Etching
                            • Micro Powder Blasting
                          • Polymeric Machining
                            • Hot Embossing
                            • Micro Injection Moulding
                            • Elastomers Casting in-situ
                            • Electrospinning
                          • Chemical & Bio-chemical Labs
                          • Characterizations
                            • Optical Microscopy
                            • Profilometry
                            • Microfluidic test
                            • Piezoelectric Characterization
                            • Fluorescence Microscopy
                            • Electron Microscopy 1
                            • Electron Microscopy 2
                            • Advanced Optical Microscopy
                            • Raman Spectroscopy 1
                            • Raman Spectroscopy 2
                            • FT-IR Spectroscopy
                            • X-ray Photoelectron Specroscopy
                            • Optical Contact Angle
                            • UV-Vis Spectroscopy
                            • Fluorescence Spectroscopy
                            • Conductive Atomic Force Microscopy
                            • Electrical and Electrochemical characterization
                            • BET
                          • Nanomechanical sensing
                            • CANTIRED
                            • SCALA
                            • Laser Doppler Vibrometer (LDV)

                          Characterizations

                          • Optical Microscopy

                          • Profilometry

                          • Microfluidic test

                          • Piezoelectric Characterization

                          • Fluorescence Microscopy

                          • Electron Microscopy 1

                          • Electron Microscopy 2

                          • Advanced Optical Microscopy

                          • Raman Spectroscopy 1

                          • Raman Spectroscopy 2

                          • FT-IR Spectroscopy

                          • X-ray Photoelectron Specroscopy

                          • Optical Contact Angle

                          • UV-Vis Spectroscopy

                          • Fluorescence Spectroscopy

                          • Conductive Atomic Force Microscopy

                          • Electrical and Electrochemical characterization

                          • BET

                          DIPARTIMENTO di SCIENZA APPLICATA E TECNOLOGIA (DISAT)

                          © Politecnico di Torino - Corso Duca degli Abruzzi, 24 - 10129 Torino, ITALY

                          P.IVA/C.F.:00518460019

                          ChiLab - Materials and Microsystems Laboratory
                          Palazzo "L. EINAUDI" - Lungo Piazza d'Armi, 6 - 10034 Chivasso (TO), ITALY
                          tel +39 011 911.48.99
                          fax +39 011 913.64.90

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                          Chilab

                          Materials and Processes for Micro & Nano Technologies