Reactive Ion Etching (RIE)
VISION 320 MK II RIE
Vision 320 RIE Specifications
- Electrode Size Electrode Temperature Electrode Material: 12" (305 mm) diameter, Aluminum with Graphite Cover
- RF Electrode Bias: 600 W power supply, 13.56 MHz
- Base Pressure: <1x10e-6 Torr
- Pressure Control: Automatic, 0 – 1 Torr
- Process Gas Lines (Digital MFCs): SF6, CHF3, O2, N2
- Control System Software: PLC (XP/Windows 7), with data logging
STS 320PC Reactive Ion Etcher (RIE)
The STS 320PC Reactive Ion Etching system is a single-chamber reactor.
Available process gases (fluorine chemistry)
- SF6, CHF3, O2 and H2
- separate mass-flow controller (MFC) for each gas
Pressure control
- pressure controlled separately by an APC valve between the chamber and the turbo-pump
Pumping system
- turbomolecular and mechanical pump in sequence, both purged by nitrogen
- ultimate vacuum: 10-6 Torr
Substrate temperature control
- heating ~30 °C
- chilling below 0 °C
Other features
- all system functions monitored by a PC-based process controller
- the reactor is surmounted by a glove box for a secure insertion and extraction of samples from the process chamber