Chilab Cleanroom

The Materials and Microsystems Laboratory cleanroom is composed of three different areas:

  • a ISO 14644 Class 5 (U.S Fed-Std 209D Class 100) yellow area validated facility (15 m2);
  • a ISO 14644 Class 6 (U.S Fed-Std 209D Class 1000) validated facility (45 m2);
  • a not classified grey area, but approximately a ISO 14644 Class 7 (U.S Fed-Std 209D Class 10000) as measured (90 m2).


Typical activities taking place within the cleanroom facility are:

  • Lithographic processes (front-backside UV exposure, laser-assisted direct writing)
  • Wet and dry etching processes
  • Conductive and dielectric thin and thick films growth (LPCVD, PECVD, e-gun evaporation, electroplating)
  • Semiconductors oxidation
  • Rapid Thermal Annealing
  • Process characterization through optical microscopy and profilometry
  • Polymers machining through hot embossing, injection moulding and casting in situ
  • Rapid Prototyping by InkJet 3D printing, Micro StereoLithography, Plastic Laser Sintering, Micro Electro-Discharge Machining and CNC milling
  • Nanofibers Elettrospinning
  • Assembly and test of micro and nanostructures

The cleanroom facility is a laminar vertical flow one and is served by ultra-pure gases, pressurized air and deionised water lines.