Diener ATTO O2 PLASMA

Diener ATTO Low pressure plasma systems is characterized for a wide range of surface processes:

• Polymer: PDMS, NOA81, resists, polyimides, SU-8
• Materials: silicon wafer (max 4inch), Glass

Productivity Enhancements:

• Data Logging: Simplified data collection for sharing of process monitoring and recipe information.
• Automatic Matching networks
• LCD touchscreen user interface

Diener ATTO Low pressure plasma systems Specifications

• Plasma Chamber made of glass: Ø 211 mm, L 300 mm; Chamber volume: 10.5 litres
• Ø 211 mm Length 300 mm
• Two gas channels via needle valve without magnet valve opening RF Electrode Bias: 600W power supply, 13.56 MHz
• Plasma Power Supply: 40 kHz/200 W
• Supply voltage 220 V - 240 V / 6 A, 50 - 60 Hz
• Vacuum Pump Suction power min. 3 m3/h
• Manual PCCE-control (Microsoft Windows CE) PC-control (Microsoft Windows POS Ready 2009) Rotary switch control
• Process Gas Lines (Digital MFCs): O2, Ar

Plasmafab 508

Available gas lines

• O2 (organics removal & cleaning)

Pumping system

• mechanical pump

Plasma generation

• radio frequency (13.56 MHz) capacitive discharge
• maximum power 500 W