Thermal & E-Gun Evaporation
E-beam evaporator [ULVAC EBX-14D system]
High-throughput or small volume production equipment for 4" wafers
Up to 4 different metals can be deposited without breaking vacuum
In situ control of thickness and deposition rate
Materials available for depositiont: Ag, Al, Au, Cu, Mo, Ni, Pt, Sn, Ti, V