Kurt J. Lesker PVD75 - RF Magnetron Sputtering                                                                                    

Thanks to the partnership with Trustech s.r.l our Group has access to another sputtering facility.

  • 4 targets equipment (multi-layered nanostructures feasible): 2 RF targets for dielectrics and 2 DC targets for metals
  • Manual sample loading, but automatic processes are feasible
  • Thickness monitor in situ
  • Available gas lines: Ar, O2, N2
  • Heatable substrate (maximum heating T: 600°C)
  • Maximum RF power: 300 W
  • Magnetron sputtering for higher ionization degree