Sputtering
Kurt J. Lesker PVD75 - RF Magnetron Sputtering
Thanks to the partnership with Trustech s.r.l our Group has access to another sputtering facility.
- 4 targets equipment (multi-layered nanostructures feasible): 2 RF targets for dielectrics and 2 DC targets for metals
- Manual sample loading, but automatic processes are feasible
- Thickness monitor in situ
- Available gas lines: Ar, O2, N2
- Heatable substrate (maximum heating T: 600°C)
- Maximum RF power: 300 W
- Magnetron sputtering for higher ionization degree