Deep Reactive Ion Etching (DRIE)

ICP-DRIE Oxford Plasmalab 100                                                                                        


Thanks to the strategic partnership with Trustech s.r.l., our Group has access to their DRIE facility installed in Techfab.

• Double chamber reactor (loadloack chamber for 6" wafers loading)

• Bosch® & Cryogenic (Deep Reactive Ion Etching - DRIE) dry etching system for high aspect ratio etching

• Equipped with the following process gases: O2, Ar, SF6, CHF3, C4F8